MXCHIP Information Technology EMB1061 BLE module User Manual

Shanghai MXCHIP Information Technology Co.,Ltd. BLE module Users Manual

User Manual

Shanghai MXCHIP Information Technology Co., Ltd.9th Floor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai.（200333）Tel.: 021-52655026 Website: http://mxchip.com/Track Number: AN0092ENMXCHIP Co., LtdVersion: 1.02017.7.11Category: Application NoteOpenEMB1061 Hardware Design GuideAbstractThis document lists the consideration in each step during designing product with MXCHIP module. In orderto achieve rapid mass production, Users should be familiar with the document to pre-consider and avoid problemseffectively in designing, producing, programming and testing.More HelpFor more products information please visit: http://mxchip.com/For more development data please go to MiCO developer bbs: http://mico.io/For more Fogcloud data please go to Fogcloud developer center: http://easylink.io/Copyright NoticeMxchip copyrights this specification. No part of this specification may be reproduced in any form ormeans(specially brand, type name, part number and pictures), without the prior written consent of Mxchip.
Application Note [Page 1]EMB1061 Hardware Design GuideVersion RecordDateVersionDetails2017-7-11V1.0Initial release
Application Note [Page 2]EMB1061 Hardware Design Guide目录EMB1061 Hardware Design Guide.....................................................................................................................................1Version Record...................................................................................................................................................................... 11. Introduction.......................................................................................................................................................................32. Hardware Design Guide................................................................................................................................................... 62.1 MECHANICAL SIZE.................................................................................................................................................... 62.1.1 EMB1061 Pin Definition........................................................................................................................... 62.2 REFERENCE PCB PACKAGE DESIGN......................................................................................................................... 72.3 DC POWER DESIGN................................................................................................................................................... 72.4 RF DESIGN................................................................................................................................................................ 82.4.1 On-board PCB Antenna Design.................................................................................................................82.4.2 External Antenna........................................................................................................................................92.5 ESD DESIGN............................................................................................................................................................103. Downloading Firmware.................................................................................................................................................. 114. Important Statement...................................................................................................................................................... 125. SMT..................................................................................................................................................................................135.1 STENCILS................................................................................................................................................................. 135.2 TEMPERATURE CURVE OF REFLOW......................................................................................................................... 146. reference design...............................................................................................................................................................157. Technical Support........................................................................................................................................................... 17Figure ContentFigure 1.1. Top view of EMB1061.........................................................................................................................3Figure 1.2 Hardware Block.................................................................................................................................... 5Figure 2.1 Top View of Mechanical Size (Unit:mm)............................................................................................. 6Figure 2.2 Minimum PCB Clearance Area............................................................................................................ 9Figure 2.3 Position of the Module..........................................................................................................................9Figure 2.4 Size of connector for external antenna.............................................................................................. 10Figure 5.1 Stencils size......................................................................................................................................... 13Figure 5.2 Temperature Curve of Secondary Reflow...........................................................................................14
Application Note [Page 3]EMB1061 Hardware Design Guide1. IntroductionThis document lists the consideration in each step during designing product with MXCHIP module. In orderto achieve rapid mass production, Users should be familiar with the document to pre-consider and avoid problemseffectively in designing, producing, programming and testing.Suitable module type:EMB1061Phase to attention:Hardware design;Firmware downloading;Firmware testing;SMT;Top view of EMB1061Figure 1.1. Top view of EMB1061EMB1061Module typeAntenna TypeIllustrationEMB1061-POn-board PCBDefaultEMB1061-EIPEXOptionalEMB1061 has two types of antenna: PCB antenna (EMB1061-P), IPEX connector (EMB1061-E).
Application Note [Page 4]EMB1061 Hardware Design GuideEMB1061-P
Application Note [Page 5]EMB1061 Hardware Design GuideEMB1061-EHardware BlockFigure 1.2 Hardware Block
Application Note [Page 6]EMB1061 Hardware Design Guide2. Hardware Design Guide2.1 Mechanical SizeMechanical size of EMB1061 (Unit: mm)Figure 2.1 Top View of Mechanical Size (Unit:mm)EMB1061 Package Definition2.1.1 EMB1061 Pin DefinitionTable 1 EMB1061 Pin DefinitionNO.NamePin of ST SOCTypeMain functionAlternative function1I2C1 DATIO13I/OI2C1 DATGPIO13
Application Note [Page 7]EMB1061 Hardware Design GuideNO.NamePin of ST SOCTypeMain functionAlternative function2I2C1 CLKIO12I/OI2C1 CLKGPIO123RESETRESETNInputReset4SWDIOIO10I/OSWDIOGPIO105SWCLKIO9I/OSWCLKGPIO96UART CTS/BOOTIO7I/OUART CTS/BOOTI2C2_DAT7UART RTSIO6I/OUART RTSI2C2_CLK8VCCVBAT2SPOWER_SUPPLY9GNDGNDSGND10UART_TXIO8I/OUSER_UART_TXSPI_CLK11UART_RXIO11I/OUSER_UART_RXGPIO1112SPI INIO3I/OSPI INPWM113SPI OUTIO2I/OSPI OUTPWM014SPI CSIO1I/OSPI CSGPIO115SPI CLKIO0I/OSPI CLKGPIO016I2C2 DATIO5I/OI2C2 DATPWM117I2C2 CLKIO4I/OI2C2 CLKPMW018IO14IO14I/OGPIO14Analog Output19AOANATEST1OAnalog OutputAnalog Output20ADC1ADC1IADC1ADC INPUT21ADC2ADC2IADC2ADC INPUT22GNDGNDSGND2.2 Reference PCB Package DesignFigure 2.1 is the reference module package design for baseplate PCB design.Solder mask openness can be the same size with EMB1061’s pad. EMB1061’s PCB thickness is 1.0mm.2.3 DC Power DesignEMB1061’s operation voltage is 1.7~3.6V with typical voltage 3.3V. The peak current of the module is about10mA.If powered by battery, please pay attention to the max voltage and minimal discharge voltage. For coin cell,the typical voltage is 3.0V, and the minimal discharge voltage is 2.0V, and in practice it usually end up dischargingat about 2.5V. For example, CR2032 coin cell, the discharge characteristics is as below picture. When choosing
Application Note [Page 8]EMB1061 Hardware Design Guidebattery, please check whether its discharge characteristics is suitable for EMB1061.If using DC-DC, DC-DC’s output voltage should be 3.3V, and it’s max current should be above 20mA. PCBroute should be particularly aware for DC/DC power supply. Compact element, excellent connection betweeninput and output ground, long distance between feedback signal and inductance and Schottky diode are requiredfor route. Details about the requirements should refer to the datasheet of DC/DC device.Maximum output current and dissipate heat should be aware for the using of LDO. For example, voltage dropis 1.7V when voltage reduces from 5V to 3.3V. If the current is 100mA, power consumption is 1.7V *100mA=170mW. Power Dissipation is a parameter of LDO, which should be over 170mW.2.4 RF Design2.4.1 On-board PCB Antenna DesignThere should not be components, or ground, or circuit 15mm away from EMB1061’s PCB antenna.
Application Note [Page 9]EMB1061 Hardware Design GuideFigure 2.2 Minimum PCB Clearance AreaIn order to reduce the influence from metal components to PCB antenna and wireless signal, it is better tomount EMB1061 on these areas, as shown in figure 2.3.Figure 2.3 Position of the Module2.4.2 External AntennaSize of connector for external antenna is shown in figure 2.4. Make sure the correct size with suppliers beforebuying the connectors of antenna.
Application Note [Page 10]EMB1061 Hardware Design GuideFigure 2.4 Size of connector for external antenna2.5 ESD DesignESD level of the module: Human body model (HBM) is 2000V, charged device model (CDM) is 500V.Position of ESD protected components should be reserved if the products require higher ESD requirement.
Application Note [Page 11]EMB1061 Hardware Design Guide3. Downloading Firmware1. Unzip the package and install the USB driver "CDM 2.08.30 WHQL Certified_64".2.Power supply to the development board through USB interface. View its corresponding serial port numberfrom device Manager. 3. Enter BOOTLOADER mode. After confirming that the module is powered (a red LEDlights up next to the USB port), hold down the BOOT button and reset the module through the Reset button, thenrelease the BOOT button. If the operation succeeds, EMB1061 enters BootLoader mode. 4. Open firmwareupgrade tool software, select module EMB1061, select user serial port number and fix A document.5. Select the firmware file to upgrade (click the firmware button), and if everything is normal, you will seethe upgrade button brighten. Indicates that you can upgrade. Hover over the firmware button to see the absolutepath of the firmware that has been selected. As shown in the figure:6. Click the upgrade button and a dialog box will pop up to prompt the user to confirm that the module is nowin BootLoader mode. Click OK to start the upgrade, as shown in figure:7. After a successful upgrade, the module will automatically Reset and run from the latest firmware. If thereis an error in the upgrade process, the tool will pop up an error prompt, according to which the user can furtherprocess.
Application Note [Page 12]EMB1061 Hardware Design Guide4. Important StatementMXCHIP has a duty to make sure there is no quality problem when sell the module to customers.Customers have the rights to ask MXCHIP to exchange goods if the product has quality problem.If the customer find the problem after welding the module on board without testing at the beginning,MXCHIP is only responsible for the compensation of the module part.MXCHIP would help customers solve technical problem in developing firmware without save any MVA/binfile. Customers should save different development vision and download relative vision in module beforeproducing.
Application Note [Page 13]EMB1061 Hardware Design Guide5. SMT5.1 StencilsStencils thickness is suggested to be 0.12mm (0.1~0.15mm) with Laser grinding. Recommended solder paste:No lead SAC305.Stencils size is shown in figure 5.1, pad holes extend 0.15mm in order to improving solder wicking. Soldermask’s width should be 0.1mm wider than stencil’s paste layer, like Pin1 of Figure 5.1. So that if there is no AOItesting, you can check whether the module is placed well by eye to reduce the Pseudo Soldering.There is EMB1061’s PCB lib in mxchip.com, and you can use it directly.Figure 5.1 Stencils size
Application Note [Page 14]EMB1061 Hardware Design Guide5.2 Temperature Curve of ReflowPseudo soldering could be reduced by control the furnace with temperature curve of secondary reflow, asshown in figure 5.2.Secondary reflow times should be less than twice.1. Max Rising Slope : 3℃/sec2. Max Falling Slope: -3 ℃/sec3. Preheat Time(150℃~200℃): 60sec~120sec4. Over 217℃Time:40sec~70sec5. Peak Temp.240℃~250℃Figure 5.2 Temperature Curve of Secondary Reflow
Application Note [Page 15]EMB1061 Hardware Design Guide6. reference designPower source circuitUSB to UARTFigure 12 USB to UARTexternal interface circuitFigure 13 External Interface Circuit of EMB1061Voltage of EMB1061 UART is 3.3V. 5V UART should convert to 3.3V UART for the users that have 5V
Application Note [Page 16]EMB1061 Hardware Design Guidechips. Convert circuit is shown in figure 14.Figure 14 3.3V UART- 5V UART Convert Circuit
Application Note [Page 17]EMB1061 Hardware Design Guide7. Technical SupportFor consultation or purchase the product, please contact Mxchip during working hours:From Monday to Friday, morning 9:00~12:00, afternoon 13:00~18:00Telephone: +86-21-52655026Contact address: 9th Floor, No.5, Lane2145 JinshaJiang Road Putuo District, ShangHai.Postcode：200333Email: sales@mxchip.com
Application Note [Page 1]EMB1061 Hardware Design GuideFCC Regulations:This device complies with part 15 of the FCC Rules. Operation is subject to the following twoconditions: (1) This device may not cause harmful interference, and (2) This device must accept anyinterference received, including interference that may cause undesired operation.This device has been tested and found to comply with the limits for a Class B digital device ,pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protectionagainst harmful interference in a residential installation. This equipment generates, uses and canradiated radio frequency energy and, if not installed and used in accordance with the instructions,may cause harmful interference to radio communications. However, there is no guarantee thatinterference will not occur in a particular installation If this equipment does cause harmfulinterference to radio or television reception, which can be determined by turning the equipment offand on, the user is encouraged to try to correct the interference by one or more of the followingmeasures:-Reorient or relocate the receiving antenna.-Increase the separation between the equipment and receiver.-Connect the equipment into an outlet on a circuit different from that to which the receiver isconnected.-Consult the dealer or an experienced radio/TV technician for help.Caution: Changes or modifications not expressly approved by the party responsible forcompliance could void the user‘s authority to operate the equipment.RF Exposure InformationThis device complies with FCC radiation exposure limits set forth for an uncontrolledenvironment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits,human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation.IMPORTANT NOTE:This module is intended for OEM integrator. The OEM integrator is still responsible for the FCCcompliance requirement of the end product, which integrates this module. 20cm minimum distancehas to be able to be maintained between the antenna and the users for the host this module isintegrated into. Under such configuration, the FCC radiation exposure limits set forth for anpopulation/uncontrolled environment can be satisfied.Any changes or modifications not expressly approved by the manufacturer could void the user'sauthority to operate this equipment.
Application Note [Page 2]EMB1061 Hardware Design GuideUSERS MANUAL OF THE END PRODUCT:In the users manual of the end product, the end user has to be informed to keep at least 20cmseparation with the antenna while this end product is installed and operated. The end user has to beinformed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can besatisfied. The end user has to also be informed that any changes or modifications not expresslyapproved by the manufacturer could void the user's authority to operate this equipment. If the size ofthe end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to beavailable in the users manual: This device complies with Part 15 of FCC rules. Operation is subject tothe following two conditions: (1) this device may not cause harmful interference and (2) this devicemust accept any interference received, including interference that may cause undesired operation.LABEL OF THE END PRODUCT:The final end product must be labeled in a visible area with the following " Contains TransmitterModule FCC ID: P53-EMB1061 ". If the size of the end product is larger than 8x10cm, then thefollowing FCC part 15.19 statement has to also be available on the label: This device complies withPart 15 of FCC rules.Operation is subject to the following two conditions: (1) this device may not cause harmfulinterference and (2) this device must accept any interference received, including interference thatmay cause undesired operation.

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