Microchip Technology BM70ABCDEFGH Bluetooth Module User Manual RN4020 Bluetooth Low Energy Module Data Sheet

Microchip Technology Inc. Bluetooth Module RN4020 Bluetooth Low Energy Module Data Sheet

Manual

BM70/BM71 Bluetooth® 4.2 BLE Module Features • Bluetooth® Smart 4.2 BLE compliant • 1.9V~3.6V operating range • UART/ I2C/ SPI interface supported • PWM supported(3-ch for BM70, 1-ch for BM71) • Temperature range (-20℃~70℃) • Main Crystal : 32MHz • Temperature sensor supported • 12 bits ADC supported for 6CH(BM70) /4CH(BM71) input ports and battery voltage detection • Wake up by any GPIO • Peak current: TX 13mA/RX 13mA with Buck,@ VBAT=3.0V • RSSI Monitor RF/Analog Features • ISM Band 2.402 to 2.480 GHz operation • Channels 0-39 • Rx Sensitivity: -90 dBm@ BLE, in typical • Tx Power: +2 dBm, support class 2 power output • RSSI monitor Antenna • Ceramic Chip Antenna (BM70BLES1FC2/BM71BLES1FC2) • External Antenna Connection via RF pad (BM70BLE01FC2/BM71BLES1FC2) FIGURE 1: (BM71 NA) Description The BM70/BM71 BLE module is designed for App-enabled accessories and IoT (Internet of Things) through Bluetooth® connectivity. It is available in the 2.4GHz ISM band radio, compatible with Bluetooth Core Specification Version 4.2 to enhance the throughputs and security for IoT applications. For improving user experiences for IoT applications, the patent and trademark for Beacon Things Technology is applied to let users can control automatically and receive data to cloud without open App through iPhone. The module build-in Bluetooth® stacks to be embedded Bluetooth® LE solution, so developer can save time to finish their design without taking efforts to care Bluetooth® issue. In addition, it narrows down the module size and minimizes its cost. For portable and wearable applications, the product optimized power design to minimize current consumption to extend battery life. Applications • IoT/ IoE • Payment/ Security • Wearable devices • Smart Home • Smart Health • Apple iBeacon • Digital Sports • Proximity/ Find Me
BM70/BM71 Table of Contents 1.0 PRODUCT OVERVIEW .............................................................................................................. 5 1.1 Interface Description ............................................................................................................. 6 1.2 Configuring the BM70/BM71 ............................................................................................ 9 1.3 UART Interface .................................................................................................................. 9 1.4 Control and Indication I/O Pins ........................................................................................ 9 1.5 RESET (RST_N) .............................................................................................................. 10 1.6 System Configuration ...................................................................................................... 10 1.7 Power ................................................................................................................................ 11 1.8 Mounting Details .............................................................................................................. 12 1.9 Soldering Recommendations ........................................................................................ 13 2.0 APPLICATION INFORMATION ............................................................................................. 21 2.1 External Configuration and Programming ................................................................... 21 2.2 Reference Circuit ............................................................................................................. 21 2.2.1 Power Drop Protection ........................................................................................ 24 2.3 BM70BLES1FC2/BM71BLES1FC2 Ceramic Chip Antenna ..................................... 24 2.4 UART ready after Reset & Power On Timing .............................................................. 26 2.5 Power On Reset Timing ................................................................................................. 26 2.6 Power Consumption ........................................................................................................ 27 3.0 REGULATORY APPROVAL ................................................................................................... 29 3.1 United States .............................................................................................................. 29 3.1.1 LABELING AND USER INFORMATION REQUIREMENTS ............................ 29 3.2 Canada .............................................................................................................................. 31 3.2.1 LABELING AND USER INFORMATION REQUIREMENTS ................................. 31 3.2.2 RF EXPOSURE ....................................................................................................... 32 3.2.3 HELPFUL WEB SITES........................................................................................... 32 3.3 Europe ............................................................................................................................... 33
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BM70/BM71 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. Abbreviations List: BLE: Bluetooth Low Energy IOT: Internet of Things 2015 Microchip Technology Inc. Advance Information page 3
BM70/BM71 1.0 PRODUCT OVERVIEW BM70 and BM71 are embedded 2.4 GHz Bluetooth® Version 4.2 (BLE) modules. The chip inside incorporates Bluetooth stack, power management subsystem, 2.4 GHz transceiver, and RF power amplifier. With the module developers can add Bluetooth® functionality rapidly for any IoT devices. The BM70 and BM71 provide cost and time to market savings as a self‐contained module solution. The modules have been designed to provide developers with a simple Bluetooth® solution as below: • Ease of integration and programming • Vastly reduced development time • Minimum system cost and highest quality for wireless module • Interoperability with Apple iOS and Google Android OS • Maximum value in a range of applications In addition, BM70 and BM71 also provide the BeaconThings® Technology to improve user experiences for IoT applications: • Auto Connection/Control • Data to Cloud Easily The BM70 and BM71 can independently maintain a low power wireless connection. Low power usage and flexible power management maximize the module’s lifetime in battery operated devices. A wide operating temperature range allows use in indoor and outdoor environments. BM71 is the small form factor for wearable, compact, surface mount module with castellated pads for easy and reliable host PCB mounting. TABLE 1‐1: BM70/BM71 MODULE FAMILY TYPES Part Number Antenna on Board Shielding Pin # Dimension BM70BLE01FC2 No (External) No 28 12mm x 15mm BM70BLES1FC2 Yes Yes 33 12mm x 22mm BM71BLE01FC2 No (External) No 17 6mm x 8mm BM71BLES1FC2 Yes Yes 16 9mm x 11.5mm 2015 Microchip Technology Inc. Advance Information page 4
BM70/BM71 1.1 Interface Description The block diagram of BM70/BM71 is shown in Figure 1-1. Pin diagram is shown in Figure 1-2 and the pin descriptions are shown in Table 1-1. Test pads on button side of each module, which are used for production test, are listed in Table 1-2. FIGURE 1-1: BM70/BM71 BLOCK DIAGRAM Advance Information 2015 Microchip Technology Inc. page 5
BM70/BM71 FIGURE 1-2: BM70/BM71 PIN DIAGRAM Advance Information 2015 Microchip Technology Inc. page 6 BM70BLES1FC2 BM70BLE01FC2 BM71BLE01FC2 BM71BLES1FC2
BM70/BM71 TABLE 1-1: PIN DESCRIPTION BM70BLE01FC2 BM70BLES1FC2 BM71BLE01FC2 BM71BLES1FC2 Symbol Type Description -- ‐ 1 -- -- GND Power Ground reference -- ‐ 2 -- -- GND Power Ground reference 1 3 12 13 GND Power Ground reference 2 4 11 14 VBAT Power Battery input. Main positive supply input. Voltage Range: 1.9V~3.6V 10 -- BK_IN Power Buck input. Main positive supply input. Connect to 10uF low ESR ceramic capacitor. Voltage Range: 1.9V~3.6V 3 5 -- -- P2_2 DIO GPIO, default pull-high input PWM1 4 6 -- -- VDD_IO Power I/O positive supply. Ensure VDD_IO and MCU I/O voltage are compatible 5 7 -- -- VDD_IO Power I/O positive supply. Ensure VDD_IO and MCU I/O voltage are compatible 6 8 -- -- ULPC_O Power 1.2V Programmable ULPC LDO Output for AON-logic and Retention Memory Supply 7 9 -- -- P2_3 DI GPIO, default pull-high input PWM2 8 10 -- -- BK_O Power 1.55V buck output 13 6 P1_6 DIO AO P1_6 External 32.768KHz Crystal Input: XI32K 14 5 P1_7 DIO AI P1_7 External 32.768KHz Crystal Output: XO32K 9 11 15 15 P2_7 DIO AI DO DO GPIO, default pull-high input AD14 NCS2 : : 2nd SPI-Bus (Master mode) TX_IND 10 12 -- -- P1_1 DIO AI DI GPIO, default pull-high input AD9 MISO2 : 2nd SPI-Bus (Master mode) 11 13 2 3 P1_2 DIO AI I/O GPIO, default pull-high input AD10 I2C SCL. 12 14 3 4 P1_3 DIO AI DIO GPIO, default pull-high input AD11 I2C SDA 13 15 8 11 P0_0 DIO AI DI GPIO, default pull-high input AD0 UART flow-control CTS 14 16 -- -- P1_0 DIO AI GPIO, default pull-high input AD8 15 17 6 9 P3_6 DIO DO DO GPIO, default pull-high input PWM0 UART flow-control RTS 16 18 16 16 P2_0 DIO System configuration, default pull-high input H  Application L  test mode. 2015 Microchip Technology Inc. Advance Information page 7
BM70/B71 17 19 -- -- P2_4 DIO GPIO, default pull-high input 18 20 -- -- NC No Connection 19 21 7 10 RST_N DI Module Reset(active low) (internal pull-up) Apply pulse of at least 63 nS 20 22 5 7 HCI_RXD DI HCI UART Data Input 21 23 4 8 HCI_TXD DO HCI UART Data Output 22 24 -- -- P3_1 DIO DO DO GPIO, default pull-high input SPI-Bus: NCS SPI-flash : CSN 23 25 -- -- P3_2 DIO DO DO GPIO, default pull-high input SPI-Bus: MISO SPI-flash : SDO 24 26 -- -- P3_3 DIO DI DI GPIO, default pull-high input SPI-Bus: MOSI SPI-flash : SDI 25 27 -- -- P3_4 DIO DO DO GPIO, default pull-high input SPI-Bus: SCLK SPI-flash : SCK 26 28 -- -- P3_5 DIO AI GPIO, default pull-high input LED1 27 29 -- -- P0_7 DIO AI GPIO, default pull-high input AD7 28 30 9 12 P0_2/LED DIO AI AI P02 AD2 LED0 29 31 17 2 GND Power Ground reference -- 32 -- -- GND Power Ground reference 30 -- 1 1 BT_RF AIO External Antenna Connection (50 Ω) -- 33 -- -- GND Power Ground reference Note 1: Pin type abbreviation: A = Analog, D = Digital, I = Input, O = Output. Table 1-2 Test Points on Button Side BM70BLE01FC2 BM70BLES1FC2 BM71BLE01FC2 BM71BLES1FC2 Symbol Type Description TP-1 TP-1 TP-3 TP-3 VCC_PA Power 1.55V RF PA LDO Output TP-2 TP-2 TP-1 TP-5 CLDO_O Power 1.2V CLDO Output TP-3 TP-3 TP-2 TP-2 VCC_RF Power 1.2V RF LDO Output -- -- TP-4 TP-4 ULPC_O Power 1.2V ULPC LDO Output -- -- TP-5 TP-1 BK_O Power 1.55V Buck Output 1.2 Configuring the BM70/BM71 Configuring the BM70/BM71 features and service table can be performed by using the “Windows UI Configuration tool”. The detail information will be disclosed in the Application Note. 1.3 UART Interface Figures 1-4 and 1-5 show Power and MCU interface examples The BM70 UART pins TXD and RXD connect to the UART pins of the host MCU. It is highly recommended to use hardware flow control pins RTS and CTS. The BM70 hardware flow control is disabled by default and must be configured to enable. The UART Baud rate is configurable. 1.4 Control and Indication I/O Pins I/O pins on BM70 are configurable control and indication I/O. Control signals are input to the BM70. Indication signals are output from the BM70. Table 1‐3 shows configurable I/O pin assignment to control and indication signals example of BM70 BLEDK3 application. Note that for different BM70 application, the I/O assignment is different. The detail information will be disclosed in the related application note and configurable in the dedicated “UI Configuration Tool”. 2015 Microchip Technology Inc. Advance Information Page 8
BM70/BM71 TABLE 1‐3: CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM70 BLEDK3 APPLICATION N/C LOW_BATTERY_IND RSSI_IND LINK_DROP UART_RX_IND PAIRING_KEY RF_ACTIVE_IND BLEDK_STATUS1_IND (*Note) BLEDK_STATUS2_IND (*Note) P10 Default P31 Default P32 Default P33 Default P34 Default P07 Default P11 Default P22 Default P24 Default P35 Default *Note: Detail BLEDK status indication please see BLEDK3 release note. For the BM70 BLEDK3 example, some I/O functions are fixed to dedicated function as listed in Table 1-4. TABLE 1-4: FIX I/O ASSIGNMENTS FOR BM70 BLEDK3 APPLICATION P36 UART_RTS P00 UART_CTS P27 TX_IND P12 I2C/SCL P13 I2C/SDA P02 LED0 P31 SPI BUS/ NCS P32 SPI BUS/ MISO P33 SPI BUS/ MOSI P34 SPI BUS/ SCLK 1.5 RESET (RST_N) The Reset (RST_N) input pin resets the BM70/BM71 (active low pulse for at least 63 ns). 1.6 System Configuration I/O pins P20 place the BM70 into operation modes as shown in Table1-5. P20 have internal pull-up. TABLE 1‐5: SYSTEM CONFIGURATION SETTINGS P20 Operational Mode High Application Mode Low Test Mode (Write UI/Flash: Firmware Programming) 2015 Microchip Technology Inc. Advance Information Page 9
BM70/BM71 1.7 Power Figure 1-4 shows an example power scheme using a 3.3 volt low-dropout (LDO) regulator supplying 3.3 volts to both the BM70/BM71 (BAT_IN and VDD_IO) and MCU VDD. This power scheme ensures that BM70 and MCU I/O voltages are compatible. Figure 1-5 shows an example power scheme using a button cell battery. For BM71, a 10uF cap(X5R/X7R) is applied to BAT_IN pin. BM71BLES1FC2 need to connect BK_IN with VBAT. FIGURE 1-4: BM70/BM71 TO MCU INTERFACE EXAMPLE – 3.3V LDO 2015 Microchip Technology Inc. Advance Information Page 10
BM70/BM71 FIGURE 1-5: BM70 EMBEDDED APPLICATION EXAMPLE – Button Cell Battery 1.8 Mounting Details BM70BLES1FC2 The BM70BLES1FC2 physical dimensions are shown in Figure 1-6, recommended host PCB footprint in Figure 1-7, and mounting suggestion in Figure 1-8. There should not be top copper layer near the test pin area shown in Figure 1-7. When laying out the host PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in Figure 1-8. A low-impedance ground plane will ensure best radio performance (best range, lowest noise). Figure 1-8 shows a minimum ground plane area to the left and right of the module for best antenna performance. The ground plane can be extended beyond the minimum recommended as need for host PCB EMC noise reduction. For best range performance, keep all external metal away from the ceramic chip antenna at least 30 mm. BM70BLE01FC2 The BM70BLE01FC2 physical dimensions are shown in Figure 1-9, recommended host PCB footprint in Figure 1-10, and mounting suggestion in Figure 1-11. It is highly recommended to layout the host PCB as suggested in Figure 1-11. A low-impedance ground plane will ensure best radio performance (best range, lowest noise). Pin 30 (BT_RF) is a 50 ohm connection to an external antenna connector, PCB trace antenna, or component (ceramic chip) antenna through a host PCB 50 ohm micro-strip trace. This trace can be extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test posts. It is recommended that the micro-strip trace be as short as possible for minimum loss and best impedance matching. If the micro-strip trace is longer, it should be a 50 ohm impedance. Figure 1-11 shows an example connection to U.FL connector. 2015 Microchip Technology Inc. Advance Information Page 11
BM70/BM71 BM71BLES1FC2 The BM71BLES1FC2 physical dimensions are shown in Figure 1-12, recommended host PCB footprint in Figure 1-13, and mounting suggestion in Figure 1-14. There should not be top copper layer near the test pin area shown in Figure 1-13. When laying out the host PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in Figure 1-14. A low-impedance ground plane will ensure best radio performance (best range, lowest noise). Figure 1-14 shows a space area around antenna section for best antenna performance. The ground plane can be extended beyond the minimum recommended as need for host PCB EMC noise reduction. For best range performance, keep all external metal away from the ceramic chip antenna at least 30 mm. BM71BLE01FC2 The BM71BLE01FC2 physical dimensions are shown in Figure 1-15, recommended host PCB footprint in Figure 1-16, and mounting suggestion in Figure 1-17. It is highly recommended to layout the host PCB as suggested in Figure 1-17. A low-impedance ground plane will ensure best radio performance (best range, lowest noise). Pin 1 (BT_RF) is a 50 ohm connection to an external antenna connector, PCB trace antenna, or component (ceramic chip) antenna through a host PCB 50 ohm micro-strip trace. This trace can be extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test posts. It is recommended that the micro-strip trace be as short as possible for minimum loss and best impedance matching. If the micro-strip trace is longer, it should be a 50 ohm impedance. Figure 1-17 shows an example connection to U.FL connector. 1.9 Soldering Recommendations The BM70/BM71 wireless module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles. To avoid damaging the module, the following recommendations are given:  Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233) provides solder reflow recommendations  Do not exceed peak temperature (TP) of 250 deg C  Refer to the solder paste data sheet for specific reflow profile recommendations  Use no-clean flux solder paste  Do not wash as moisture can be trapped under the shield  Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. 2015 Microchip Technology Inc. Advance Information Page 12
BM70/BM71 FIGURE 1-6: BM70BLES1FC2 MODULE DIMENSIONS FIGURE 1-7: BM70BLES1FC2 RECOMMEDED PCB FOOTPRINT 2015 Microchip Technology Inc. Advance Information Page 13
BM70/BM71 FIGURE 1-8: BM70BLE01FC2 HOST PCB MOUNTING SUGGESTION Top and Bottom Copper layer keep out areaTop Copper LayerBottom Copper Layer>6.4mm>4.7mmEdge ofhost PCB . 2015 Microchip Technology Inc. Advance Information Page 14
BM70/BM71 FIGURE 1-9: BM70BLE01FC2 MODULE DIMENSIONS FIGURE 1-10: BM70BLE01FC2 RECOMMEDED PCB FOOTPRINT 2015 Microchip Technology Inc. Advance Information Page 15
BM70/BM71 FIGURE 1-11: BM70BLE01FC2 HOST PCB MOUNTING SUGGESTION Top Copper LayerBottom Copper Layer 2015 Microchip Technology Inc. Advance Information Page 16 Note: Keep out layer marked as is the test point position under module.
BM70/BM71 FIGURE 1-12: BM71BLES1FC2 MODULE DIMENSIONS FIGURE 1-13: BM71BLES1FC2 RECOMMEDED PCB FOOTPRINT FIGURE 1-14: BM71BLES1FC2 HOST PCB MOUNTING SUGGESTION 2015 Microchip Technology Inc. Advance Information Page 17
BM70/BM71 FIGURE 1-15: BM71BLE01FC2 MODULE DIMENSIONS FIGURE 1-16: BM71BLE01FC2 RECOMMEDED PCB FOOTPRINT 2015 Microchip Technology Inc. Advance Information Page 18
BM70/BM71 FIGURE 1-17: BM71BLE01FC2 HOST PCB MOUNTING SUGGESTION 2015 Microchip Technology Inc. Advance Information Page 19
BM70/BM71 2.0 APPLICATION INFORMATION 2.1 External Configuration and Programming The BM70 module can be configured and firmware programmed using an external configuration and programming tool. Figure 2-1 shows the connections between the module and test points, it is recommended to include these test points on the host PCB for development. Configuration and firmware programming modes are entered according to the system configuration I/O pins (see Section 1.6). FIGURE 2-1: EXTERNAL PROGRAMMING HEADER CONNECTIONS 2.2 Reference Circuit Figure 2-2 ~ 2-5 show the BM70 and BM71 reference circuit. Figure In which UART, LED, GPIO, test interface and RF matching circuit are listed. GPIOs are configurable and the connection depends on user’s application circuit. Power input range is 1.9V~3.6V. If battery is used, battery reverse protection circuit is suggested. The VDD_IO voltage is the same as power input. If LED display is used, be sure the power voltage > 3.0V to make it visual. RF antenna matching circuit in BM70BLE01FC2 also needs to be reserved to fine tune the antenna impedance matching. 2015 Microchip Technology Inc. Advance Information Page 20
BM70/BM71 FIGURE 2-2: BM70BLES1FC2 Reference Circuit Figure 2-3 shows the BM70BLES1MC2 reference circuit, the RF antenna circuit is not included. FIGURE 2-3: BM70BLE01FC2 Reference Circuit 2015 Microchip Technology Inc. Advance Information Page 21
BM70/BM71 FIGURE 2-4: BM71BLE01FC2 Reference Circuit FIGURE 2-5: BM71BLES1FC2 Reference Circuit 2015 Microchip Technology Inc. Advance Information Page 22
BM70/BM71 2.2.1 Power Drop Protection In order to prevent the BLE module disordering when power drop to low working voltage less than 1.9V, a reset chip with “Open Drain” type , delay time ≦ 10ms and triggered at 1.8V output voltage is recommended. Figure 2-7 shows the reset circuit block diagram. FIGURE 2-7: Optional Reset Circuit Block Diagram 2.3 BM70BLES1FC2/BM71BLES1FC2 Ceramic Chip Antenna The BM70BLES1FC2 and BM71BLES1FC2 module contains an integral ceramic chip antenna. The antenna performance on the module is shown in Figure 2-6. FIGURE 2-6: BM70BLES1FC2 ANTENNA RADIATION PATTERN Frequency 2442 MHz Max Gain 4.7dBi Efficiency 56.9% 2015 Microchip Technology Inc. Advance Information Page 23
BM70/BM71 FIGURE 2-7: BM71BLES1FC2 ANTENNA RADIATION PATTERN Frequency 2442 MHz Max Gain 0.1dBi Efficiency 42.7% 2015 Microchip Technology Inc. Advance Information Page 24
BM70/BM71 2.4 UART ready after Reset & Power On Timing In MCU application, the timing period between reset/power on and BM70 UART ready need to be notified,. The timing diagram in Figure 2-2 illustrates the timing of BM70 UART port ready for test mode and application mode after reset. Figure 2-3 shows the timing of BM70 UART port ready for test mode and application mode after power on. In application mode, when BM70 ready to talk to MCU after reset, it will have either status pin indication standby mode (see UI setting) or status report UART command to inform MCU that it is ready for communication. FIGURE 2-2: Timing diagram of BM70 UART ready for test mode and application mode after reset 2.5 Power On Reset Timing FIGURE 2-3: Timing diagram of BM70 UART ready for test mode and application mode after power on 2015 Microchip Technology Inc. Advance Information Page 25 1mS 25mS 46mS 68mS Ext Reset Test Mode Process Application Mode Process P2_0=0 P2_0=1 UART Ready for MCU UART Ready for MCU Status pin/UART Report Command VBAT Test Mode Process 25mS P2_0=0 P2_0=1 UART Ready for MCU UART Ready for MCU Application Mode Process 46mS 68mS Status pin/UART Report Command
BM70/BM71 2.6 Power Consumption Figure 2-4 and 2-5 illustrate the TX/RX mode peak current consumption in connected mode. In both modes, the peak current of VBAT input is about 13mA. FIGURE 2-4: Current consumption of RF TX in connected mode FIGURE 2-5: Current consumption of RF RX in connected mode In BM70 BLEDK3 application, 4 basic modes of BLE device have defined in Table 1-6. A current consumption measurement example includes test condition and test environment setup is described in document “BM70 and BLEDK3 Application Note”. In the example the connected mode TX/RX data transfer has also be tested. 2015 Microchip Technology Inc. Advance Information Page 26
BM70/BM71 TABLE 1‐6: Status Definition of BLEDK3 Application Example Status Description Shutdown Mode BLEDK3 is shutdown Standby Mode BLEDK3 sends advertising packets and wait for connection. BLEDK3 is under discoverable and connectable. BLE Connected Mode BLE link is established and CCCD of ISSC_Transparent_TX characteristic is disabled Transparent Service Enabled Mode BLE link is established and CCCD of ISSC_Transparent_TX characteristic is enabled Note: CCCD stands for Client Characteristic Configuration, in GATT service characteristics. 2015 Microchip Technology Inc. Advance Information Page 27
BM70/BM71 3.0 REGULATORY APPROVAL This section outlines the regulatory information for the BM70BLES1FC2 module for the following countries: • United States • Canada • Europe • Australia • New Zealand • Japan • Korea • Taiwan • Other Regulatory Jurisdictions 3.1 United States The BM70BLES1FC2 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the BM70 module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15 Subpart B “Unintentional Radiators”), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non‐transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. 3.1.1 LABELING AND USER INFORMATION REQUIREMENTS The BM70 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: Contains Transmitter Module FCC ID: BM70ABCDEFGH or Contains FCC ID: BM70ABCDEFGH This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation Contains Transmitter Module FCC ID: BM70ABCDEFGH or Contains FCC ID: BM70ABCDEFGH This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation 2015 Microchip Technology Inc. Advance Information Page 28
BM70/BM71 A user’s manual for the finished product should include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm. 3.1.1 RF EXPOSURE All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co‐located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multi‐transmitter product procedures. 3.1.2 HELPFUL WEB SITES Federal Communications Commission (FCC): http://www.fcc.gov FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm 2015 Microchip Technology Inc. Advance Information Page 29
the host device, otherwise the BM70/BM71 3.2 Canada The BM70BLES1FC2 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS‐210 and RSS‐Gen. Modular approval permits the installation of a module in a host device without the need to recertify the device. 3.2.1 LABELING AND USER INFORMATION REQUIREMENTS Labeling Requirements for the Host Device (from Section 3.2.1, RSS‐Gen, Issue 3, December 2010): The host device shall be properly labeled to identify the module within the host device. The Industry Canada certification label of a module shall be clearly visible at all times when installed in host device must be labeled to display the Industry Canada certification number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: Contains transmitter module IC: 12246A-BM70BLES1F2 User Manual Notice for License‐Exempt Radio Apparatus (from Section 7.1.3 RSS‐Gen, Issue 3, December 2010): User manuals for license‐exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device complies with Industry Canada license‐exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 2015 Microchip Technology Inc. Advance Information Page 30
BM70/BM71 3.2.2 RF EXPOSURE All transmitters regulated by IC must comply with RF exposure requirements listed in RSS‐102 ‐ Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). (Get direct quote from Certificate and place here) 3.2.3 HELPFUL WEB SITES Industry Canada: http://www.ic.gc.ca/ 2015 Microchip Technology Inc. Advance Information Page 31
BM70/BM71 3.3 Europe The BM70BLES1FC2 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The BM70 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table 3‐1: European Compliance Testing. A Notified Body Opinion has also been issued. All test reports are available on the BM70 product web page at http://www.microchip.com/bm70. The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm. Note: To maintain conformance to the testing listed in Table 3‐1: European Compliance Testing, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. 3.1.3 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM70 module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. 3.1.4 ANTENNA REQUIREMENTS From R&TTE Compliance Association document Technical Guidance Note 01: Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturer’s installation instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4] The European Compliance Testing listed in Table 3‐1 was performed using the integral ceramic chip antenna. TABLE 3‐1: EUROPEAN COMPLIANCE TESTING Certification Standards Article Laboratory Report Number Date Safety EN 60950‐1:2006+A11:2009+A1:2010 (3.1(a)) Health EN 50371:2002‐03 EMC EN 301 489‐1 V1.8.1 (2008‐04) (3.1(b)) EN 301 489‐17 V2.1.1 (2009‐05) Radio EN 300 328 V1.7.1 (2006‐10) (3.2) Notified Body Opinion 2015 Microchip Technology Inc. Advance Information Page 32 BM70/BM71 3.3.3 HELPFUL WEB SITES
A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70‐03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. Additional helpful web sites are: • Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm • European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org • European Telecommunications Standards Institute (ETSI): http://www.etsi.org • European Radio Communications Office (ERO): http://www.ero.dk • The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA): http://www.rtteca.com/ 3.2 Australia The Australia radio regulations do not provide a modular approval policy similar to the United States (FCC) and Canada (IC). However, BM70 module RF transmitter test reports can be used in part to demonstrate compliance in accordance with ACMA Radio communications “Short Range Devices” Standard 2004 (The Short Range Devices standard calls up the AS/NZS 4268:2008 industry standard). The BM70 module test reports can be used as part of the product certification and compliance folder. For more information on the RF transmitter test reports, contact Microchip Technology Australia sales office. To meet overall Australian final product compliance, the developer must construct a compliance folder containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of Conformity) etc. It is the responsibility of the integrator to know what is required in the compliance folder for ACMA compliance. All test reports are available on the BM70 product web page at http://www.microchip.com. For more information on Australia compliance, refer to the Australian Communications and Media Authority web site http://www.acma.gov.au/. 3.2.1 HELPFUL WEB SITES The Australian Communications and Media Authority: www.acma.gov.au/. 3.3 New Zealand The New Zealand radio regulations do not provide a modular approval policy similar to the United States (FCC) and Canada (IC). However, BM70 module RF transmitter test reports can be used in part to demonstrate compliance against the New Zealand “General User Radio License for Short Range Devices”. New Zealand Radio communications (Radio Standards) Notice 2010 calls up the AS / NZS 4268:2008 industry standard. The BM70 module test reports can be used as part of the product 2015 Microchip Technology Inc. Advance Information Page 33
BM70/BM71 certification and compliance folder. All test reports are available on the BM70 product web page at http://www.microchip.com/bm70. For more information on the RF transmitter test reports, contact Microchip Technology sales office. Information on the New Zealand short range devices license can be found in the following web links: http://www.rsm.govt.nz/cms/licensees/types‐oflicence/general‐user‐licences/short‐range‐devices and http://www.rsm.govt.nz/cms/policy‐and‐planning/spectrum‐policy‐overview/legislation/gazette‐ notices/product‐compliance/ . To meet overall New Zealand final product compliance, the developer must construct a compliance folder containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of Conformity) etc. It is the responsibility of the developer to know what is required in the compliance folder for New Zealand Radio communications. For more information on New Zealand compliance, refer to the web site http://www.rsm.govt.nz/. 3.3.1 HELPFUL WEB SITES Radio Spectrum Ministry of Economic Development: http://www.rsm.govt.nz/. 3.4 Japan The BM70BLES1FC2 module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: • If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required. • There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html 3.4.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM70 module must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. The BM70 module is labeled with its own technical conformity mark and certification number. The final product in which this module is being used must have a label referring to the type certified module inside: 2015 Microchip Technology Inc. Advance Information Page 34
BM70/BM71 Contains transmitter module with certificate number: 202‐SMC066 3.4.2 HELPFUL WEB SITES Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/ 3.5 Korea The BM70BLES1FC2 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. 3.5.1 LABELING AND USER INFORMATION REQUIREMENTS The label on the final product which contains the BM70 module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. The BM70 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: (Number) 3.5.2 HELPFUL WEB SITES Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio Research Agency (RRA): http://rra.go.kr 3.6 Taiwan The BM70BLES1FC2 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. installation instructions are followed and no modifications of the module are allowed. Integration of this module into a final product does not require additional radio certification provided 3.6.1 LABELING AND USER INFORMATION REQUIREMENTS The BM70 module is labeled with its own NCC mark and certificate number as below: 2015 Microchip Technology Inc. Advance Information Page 35f CCAN15LP0500T1 202-SMD069
BM70/BM71 The user’s manual should contain below warning (for RF device) in traditional Chinese: 注意 ! 依據 低功率電波輻射性電機管理辦法 第十二條 經型式認證合格之低功率射頻電機，非經許可， 公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計 之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信； 經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。 前項合法通信，指依電信規定作業之無線電信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性 電機設備之干擾。 3.8.2 HELPFUL WEB SITES National Communications Commission (NCC): http://www.ncc.gov.tw 3.7 Other Regulatory Jurisdictions Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the module for other reasons, a certification utility is available. For further regulatory Certification Utility and documentation, contact ISSC Technologies Corp. 2015 Microchip Technology Inc. Advance Information Page 36
BM70/BM71 4.0 ELECTRICAL CHARACTERISTICS TABLE 4‐1: ENVIRONMENTAL CONDITIONS Parameter Value Temperature Range (Operating) -20℃ to +70℃ Temperature Range (Storage) -65℃ to +150℃ Relative Humidity (Operating) 10% to 90% Relative Humidity (Storage) 10% to 90% Moisture Sensitivity Level 2 TABLE 4‐2: ELECTRICAL CHARACTERISTICS Parameter Min. Typ. Max. Units Supply Voltage (VDD) 1.9 3.6 V I/O Supply Voltage (VDD_IO = VDD) 1.9 3.6 V I/O Voltage Levels ) VIL input logic levels low VSS 0.3VDD V VIH input logic levels high 0.7VDD VDD V VOL output logic levels low VSS 0.2VDD V VOH output logic levels high 0.8VDD VDD V RESET VTH,res threshold voltage 1.6 V Reset low duration 63 ns Input and Tri-State Current with Pull-up Resistor 34 48 74 Kohm Leakage current -1 1 uA Supply Current TX mode peak current @ VDD=3V, TX=0dBm, Buck Mode 13 mA RX mode peak current @ VDD=3V, Buck Mode 13 mA Link static current 60 uA Standby current 1.9 2.9 uA Power-Saving 1 1.7 uA ADC (Analog to Digital Converter) Full scale (BAT_IN) 0 3.0 3.6 V Full scale (AD0~AD15) 0 3.6 Conversion time (ENOB 8bit) 131 uS Conversion time (ENOB 10bit) 387 uS Operating current 500 uA PTS(precise temperature sensor) Detect range -20 70 ℃ Digital Output 1154 2613 Resolution 11.5 bits/℃ Accuracy -3 3 ℃ Conversion time (ENOB 8-bit) 1.5 mS Operating current 200 uA 2015 Microchip Technology Inc. Advance Information Page 37
BM70/BM71 5.0 ORDERING INFORMATION TABLE 4‐1: ORDERING INFORMATION Part Number Description BM70BLE01FC2 Bluetooth® 4.2 BLE Single Mode, Class 2, Surface Mount module,external antenna, no shield. Size: 12x15mm BM70BLES1FC2 Bluetooth® 4.2 BLE Single Mode, Class 2, Surface Mount module with antenna and shield. Size: 12x22mm BM71BLE01FC2 Bluetooth® 4.2 BLE Single Mode, Class 2, Surface Mount module, external antenna, no shield. Size: 6x8mm BM71BLES1FC2 Bluetooth® 4.2 BLE Single Mode, Class 2, Surface Mount module with antenna and shield. Size: 9x11.5mm Note: The module can only be purchased through a Microchip representative. Go to http://www.microchip.com/ for current pricing and a list of distributors carrying Microchip products. 2015 Microchip Technology Inc. Advance Information Page 38
BM70/BM71 Worldwide Sales and Service AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Dusseldorf Tel: 49-2129-3766400 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Pforzheim Tel: 49-7231-424750 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 2015 Microchip Technology Inc. Advance Information Page 39

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